NANOFABRICATION PROCESSING:



• SOFT LITHOGRAPHY
• E-BEAM LITHOGRAPHY
• REACTIVE ION ETCHING (RIE)
• INDUCTIVELY COUPLED PLASMA (ICP RIE)
• BOSCH PROCESSES (DRIE)
• WET ETCHING
• ELECTRODEPOSITION
• SPUTTERING
• THERMAL EVAPORATION
• E-BEAM EVAPORATION
• CHEMICAL VAPOR DEPOSITION (LPCVD)
• PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION (PECVD)
• ATOMIC LAYER DEPOSITION (ALD)
• THERMAL OXIDATION & DIFFUSION
• WAFER BONDING
• CHEMICAL MECHANICAL POLISHING (CMP)



CHARACTERIZATION:



• SCANNING ELECTRON MICROSCOPY (SEM)
• ENERGY-DISPERSIVE SPECTROMETRY (EDS)
• X-RAY DIFFRACTION (XRD)
• X-RAY PHOTOELECTRON SPECTROSCOPY (XPS)
• ATOMIC FORCE MICRSCOPY (AFM)
• FOUR-POINT PROBE
• ELLIPSOMETRY