PROTOTYPING  |  LOW VOLUME PRODUCTION  |  RAPID TURNAROUND

PROCESSING AND CHARACTERIZATION SERVICES

NANOFABRICATION PROCESSING:



  • SOFT LITHOGRAPHY
  • E-BEAM LITHOGRAPHY
  • REACTIVE ION ETCHING (RIE)
  • INDUCTIVELY COUPLED PLASMA (ICP RIE)
  • BOSCH PROCESSES (DRIE)
  • WET ETCHING
  • ELECTRODEPOSITION
  • SPUTTERING
  • THERMAL EVAPORATION
  • E-BEAM EVAPORATION
  • CHEMICAL VAPOR DEPOSITION (LPCVD)
  • PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION (PECVD)
  • ATOMIC LAYER DEPOSITION (ALD)
  • THERMAL OXIDATION & DIFFUSION
  • WAFER BONDING
  • CHEMICAL MECHANICAL POLISHING (CMP)



CHARACTERIZATION:



  • SCANNING ELECTRON MICROSCOPY (SEM)
  • ENERGY-DISPERSIVE SPECTROMETRY (EDS)
  • X-RAY DIFFRACTION (XRD)
  • X-RAY PHOTOELECTRON SPECTROSCOPY (XPS)
  • ATOMIC FORCE MICRSCOPY (AFM)
  • FOUR-POINT PROBE
  • ELLIPSOMETRY



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